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1

Radiation treatment of secondary effluent from a sewage treatment plant

Jinho Jung, Jeong-Hyo Yoon, Hung-Ho Chung, Myun-Joo Lee

Journal:

Radiation Physics and Chemistry

Year:

2002

Language:

english

File:

PDF, 109 KB

english, 2002

2

Catalytic Activity of Clay from Tidal Flat Sediments in the Decomposition of Perchloroethylene by Gamma-Rays

Hung-Ho Chung, Jinho Jung, Jeong-Hyo Yoon, Myun-Joo Lee

Journal:

Catalysis Letters

Year:

2001

Language:

english

File:

PDF, 76 KB

english, 2001

3

Catalytic Ozonation of PCE by Clay from Tidal Flat Sediments

Hung-Ho Chung, Jinho Jung, Jeong-Hyo Yoon, Myun-Joo Lee

Journal:

Catalysis Letters

Year:

2002

Language:

english

File:

PDF, 73 KB

english, 2002

4

Effect of dissolved metal ions on PCE decomposition by gamma-rays

Hung-Ho Chung, Jinho Jung, Jeong-Ho Yoon, Myun-Joo Lee

Journal:

Year:

2002

Language:

english

File:

PDF, 104 KB

english, 2002

5

Comparative study of H2O2 and O3 effects on radiation treatment of TCE and PCE

Jinho Jung, Jeong-Hyo Yoon, Hung-Ho Chung, Myun-Joo Lee

Journal:

Year:

2003

Language:

english

File:

PDF, 158 KB

english, 2003

6

[IEEE Proceedings of the 2005, American Control Conference, 2005. - Portland, OR, USA (June 8-10, 2005)] Proceedings of the 2005, American Control Conference, 2005. - Early warning of ship fires using Bayesian probability estimation model

Hung-Ho Lee,, Misra, M.

Year:

2005

Language:

english

File:

PDF, 244 KB

english, 2005

7

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Process Induced Wafer Warpage Optimization for Multi-chip Integration on Wafer Level Molded Wafer

Huang, Chen-Yu, Ng, Daniel, Lee, Hung-Ho, Lin, Vito, Lin, Chang-Fu, Chung, C. Key

Year:

2019

Language:

english

File:

PDF, 833 KB

english, 2019

8

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Process Induced Wafer Warpage Optimization for Multi-chip Integration on Wafer Level Molded Wafer

Huang, Chen-Yu, Ng, Daniel, Lee, Hung-Ho, Lin, Vito, Lin, Chang-Fu, Chung, C. Key

Year:

2019

File:

PDF, 833 KB

2019